32 events
Designation reflects helium’s essential role in semiconductor manufacturing and advanced energy technologies.
The U.S. Department of Commerce announced letters of intent for $389 million in research and development funding for four companies. The proposed fusion awards include $175 million for Helion Energy and $85 million for Commonwealth Fusion Systems. The funding aims to advance domestic semiconductor i
The U.S. National Science Foundation today announced an initiative to translate low-dimensional semiconductor technologies from laboratory demonstrations into platforms for U.S. manufacturers to develop and deploy advanced microelectronics. The NSF…
Samsung plans High-NA EUV for future DRAM and joins the 12-inch photomask effort.
They aim for a 12-inch mask pilot line by 2031.
High NA is used on select layers of Panther Lake in volume production.
The company also expanded panel-level packaging capacity.
Series C led by Seligman Ventures with Cisco Investments and Lumentum joining.
Intel reported 9% more performance or 18% less power than 18A at VLSI 2026.
Additional funding from Japan's IPA, equal to about $943 million.
New chiplet packaging R&D hub near the IIM-1 fab in Chitose.
Funding covers the path from R&D to 2nm mass production by 2027.
AMD, Arm, Coherent and Meta invested in the chiplet interconnect maker.
First compute platform built on 18A, available in January 2026.
An open chiplet architecture standard aimed at an open chiplet market.
Panther Lake to enter high-volume production at Intel's newest Arizona fab.
Intel will build custom CPUs with NVLink and NVIDIA will buy $5 billion of Intel stock.
SK hynix readied mass production of HBM4 stacked memory for AI.
The Trump administration agreed to invest $8.9 billion in Intel common stock.
SoftBank signed a definitive agreement to buy $2 billion of Intel common stock.
First prototype wafers at the IIM-1 fab in Chitose show working electrical characteristics.
Its first commercial spiking neural network microcontroller for edge sensors.
Intel shared progress on 18A and future nodes plus advanced packaging.
A14 promises up to 15% more speed or 30% less power than N2.
Strategic stake tied to their joint hybrid bonding system.
Round led by Samsung Securities and AFW Partners at a $2B pre-money valuation.
Commerce Department direct funding to expand Intel's US chip manufacturing.
Adds manageability system architecture and 3D packaging support.
A16 pairs nanosheet transistors with backside power, planned for production in 2026.
The brain-based system packs 1.15 billion artificial neurons.
New advanced packaging assembly and test facility planned for Northern Italy.
The Singapore panel-level packaging fab began production as valuation passed $1 billion.
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