29 events
U.S. National Science Foundation-supported researcher Jonathan Zuegel discusses the future of high-powered laser research in the United States, the ambitious NSF Optical Parametric Amplifier Line (NSF OPAL) laser facility. NSF OPAL is designed to…
From orbit, today’s space-based laser instruments measure Earth’s forests and terrain one narrow line at a time. Between those lines are enormous gaps that include millions of acres of land scientists never directly measure. NASA’s CASALS instrument will blend machine learning with an ultra-compact
U.S. National Science Foundation-supported researcher Louise Willingale discusses the most powerful laser in the United States, the NSF Zettawatt Equivalent Ultrashort Pulse Laser System, how it's being used to advance science, and how it will become…
Developers can write, run and test applications accelerated by photonic processors.
Demos include 2nm 400G per lane PAM4 and 800G ZR/ZR+ pluggable optics.
Chunlei Guo, an NSF-supported researcher, discusses his work using femtosecond lasers to design materials with highly functionalized purposes...
A coalition led by Lightmatter aims to standardize silicon photonics ready infrastructure for AI racks.
The lidar maker applies its high-power optical source and silicon photonics to AI data centers from 2027.
Lightmatter brings its photonic interconnects to NVLink Fusion based AI systems.
Ayar Labs makes its CPO products compatible with NVIDIA optical and SerDes technology.
Teramount's detachable fiber-to-chip coupling targets high-volume co-packaged optics.
The chiplet uses 16-wavelength DWDM to reach 1.6 Tbps on a single fiber.
The Photonic Fabric team and technology are now part of Marvell.
MicroVision takes the Iris and Halo lidar IP, staff and contracts from Luminar's Section 363 sale.
GUC will integrate Lightmatter's Passage 3D CPO into custom AI ASICs.
Marvell gains Celestial AI's Photonic Fabric optical I/O for package and rack scale links.
The new Native Processing Server targets AI and HPC data centers.
Adds 1550nm frequency-modulated continuous wave lidar on photonic chips to MicroVision.
The CPO design extends scale-up links across multiple racks.
First analog photonic co-processor integrated into an operating HPC center.
The integrated photonic accelerator shows ultralow latency on hard optimization problems.
A 3D CPO product meant to be integrated with XPU and switch silicon.
An optical I/O chiplet with a standard UCIe electrical interface for AI scale-up systems.
Co-packaged optics switches built with TSMC, Coherent, Lumentum and others claim 3.5x energy savings.
Built on Tower's PH18DA platform, the modulators target 3.2T optical links for AI.
The chip classified data in under half a nanosecond at over 92 percent accuracy, per Nature Photonics.
The NPU, built on the LENA architecture, targets energy-efficient HPC and AI workloads.
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