Emergingby GlyphUCIe 2.0 chiplet interconnect specification released
Adds manageability system architecture and 3D packaging support.
Advanced semiconductorsuciexpress.org
UCIe Consortium
NonprofitUS1 field
Where it works
| Technology | ||
|---|---|---|
| Advanced semiconductorsIndustry group that publishes the Universal Chiplet Interconnect Express die-to-die standard. | Industry group that publishes the Universal Chiplet Interconnect Express die-to-die standard. | uciexpress.org |
Events
About
- Source
- uciexpress.org (official, added by seed)
- First seen
- Sep 25, 2026
- Last seen
- Oct 6, 2026
- Across Glyph
- UCIe Consortium on Companies