Advanced semiconductors
Early commercialmomentum 551,130 papers in 3 months (-27% yearly)$23B raised in 12 months22 companies
Making chips with ever smaller transistors, new transistor shapes and power wiring, and stacking many chips into one package.
Why early commercial: Intel launched Core Ultra Series 3, the first compute platform built on Intel 18A with gate-all-around transistors and backside power. Jan 5, 2026
Dots under a month: dated events tracked here that month.
30 events
About advanced semiconductors here
- Sub-areas
- 2nm and below process nodes, Gate-all-around transistors, Backside power delivery, High-NA EUV lithography, Chiplets and die-to-die interconnect, Advanced packaging and hybrid bonding, Neuromorphic chips
- Stage evidence
- Early commercial, Jan 5, 2026: Intel launched Core Ultra Series 3, the first compute platform built on Intel 18A with gate-all-around transistors and backside power. intc.com
- Momentum
- 55 of 100: the mean of its ranks among the tracked fields for paper growth (6), funding in 12 months (94) and events in 90 days (66). Method
- Papers
- 6,821 in the 12 months ending two months ago, -27% against the 12 before (OpenAlex topics, journal and conference papers).
- Tracked here since
- Sep 25, 2026